Please be informed that ams AG is transferring the assembly location of ams AG WLCSP Products from Flipchip International in Phoenix Arizona to DECA Technologies in the Philippines. DECA is another qualified
Read moreDear Customer ■We will of course continue to support already placed orders and would like to give you the possibility to place your last time buy orders until March 31st 2022. ■Last shipment of the product
Read more■ MKDSN ■ 2023 01 30 ■To improve the delivery performance the production of the MKDSN PCB terminal block is being relocated from Blomberg to China. From now on the products contained in the attachments
Read moreLittelfuse would like to notify you pizza box change for DO-214AA DO-214AB TVS AUTO products and DO-214AA DO-214AB DO214AC TVS Hi Reliability products due to packing box integration. Before Change - Separated
Read moreDescription of Change: ■EPC announces the qualification of RAYTEK for PbF lead free wafer bump process for commercially released device EPC2070. There will be no change in manufacturing technology or to
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