PCN11-2015 WLCSP Product Transfer from Flipchip International to DECA Technologies
Post time:2024-06-05 16:45:04
Poster:Innovo Technology
From:Network
●Please be informed that ams AG is transferring the assembly location of ams AG WLCSP Products from Flipchip International in Phoenix, Arizona to DECA Technologies in the Philippines. DECA is another qualified assembly partner which runs our high volume products.
●Below is DECA's exact assembly house location for the aforementioned affected package: Deca Technologies (Philippines) #100 East Main Ave SunPower Compound Laguna Techno Park Binan, Laguna 4024 Philippines
●Final Electrical testing will still be performed by ams AG.
●In addition, this notification covers not only the Assembly Site Transfer but also the Material Set Change. The change in the material set was a qualified and standard material set by DECA and is fully supported by ams AG due to the advantages and benefits over the old material set.
●Purpose of Change
■The change is expected to improve the delivery performance, responsiveness and on-time delivery, without compromising Quality.
■To allow ams AG for more flexibility to meet diversified and changing customer demand.
■To reasonably protect the supply of customers' products.
■To have alternative and ready solution for issues like tight-line capacity situation, on-allocation situation, and any other manufacturing issues that can arise and potentially prevent ams AG from meeting the customer demand on time.
ams AG | |
AS3561-DWLT 、 AS3561-DWLM 、 AS5510-DWLT 、 AS5510-DWLM 、 AS5510 WLP More Part# | |
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PCN/EOL More | |
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Please see the document for details | |
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WLCSP | |
English Chinese Chinese and English Japanese | |
11-2015 | |
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354 KB |