Manufacturing Site Alternate - Qualification of Raytek for PbF wafer bump process for additional com
Post time:2024-06-05 16:44:56
Poster:Innovo Technology
From:Network
●Description of Change:
■EPC announces the qualification of RAYTEK for PbF (lead free) wafer bump process for commercially released device, EPC2070. There will be no change in manufacturing technology or to the package dimensions. This change does not affect the form, fit, or function of the product as defined in the datasheet.
■Successful qualification testing of the RAYTEK facility was performed to ensure product quality and reliability requirements are met or exceeded. RAYTEK is an existing qualified supplier for other EPC devices including commercial and AEC products. Additional qualification information can be provided upon request.
■RAYTEK will begin production of the EPC2070 on or after July, 2022. Products with date code 2230 and afterward could be produced by RAYTEK. During the transition period customers may receive shipments from any approved EPC assembly site. Shipment of such products to a customer will only occur after the customer PCN is signed off.
EPC | |
EPC2070 More Part# | |
Enhancement Mode Power Transistor More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
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English Chinese Chinese and English Japanese | |
November 29, 2022 | |
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PCN221201 | |
203 KB |