MCU/SOC products announcement of Full Carton Product Change Notice (SAG-B-22-0002)
■Description of Change: Renesas will change packing form with a tray to Full Carton full packing from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case.
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SMA, SMB, SMC Automotive Package Product Change Notification(PCNS21090701)
■Effective Date Sep 6th 2022■Impact Parts SMA SMB SMC Automotive Package■Change contents Qualify additional internal assembly and test site SAT located in Yangzhou China New design lead frame structure
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MCM-11939:Active Second Source Wafer Fab Foundry Corbeil & Melexis Probing Site Corbeil [MLX9037
■Type of change Move all or parts of production to a different wafer fab site. Move of all or part of electrical wafer test and/or final test to a different test site.■Description of change Old Current
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Wafer process site will be added for SH726x Group Products Product Change Notice (PCN) (EPMP-IMB-22-
■Description of Change: Addition of a Wafer production site : Taiwan Semiconductor Manufacturing Co. Ltd. TSMC for SH7266/SH7267/SH7268/SH7269/SH726A/SH726B Group Products. There is no change in the order
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MP 3-X2 Product Change Notification(PCN-MPX2-2022-0001)
■Description of Change: The WIMA MP 3-X2 range with capacitance values from 1000 pF to 0.33 µF and voltage ranges of 250 VAC and 275 VAC with metallized paper dielectric has been removed from the WIMA
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