■Type of change

●Move all or parts of production to a different wafer fab site.

●Move of all or part of electrical wafer test and/or final test to a different test site.

■Description of change

●Old：Current released Wafer Fab Location: X-fab Kuching (Sarawak / Malaysia)

●New：Current released Wafer Fab Location: X-fab Kuching (Sarawak / Malaysia)+ X-fab Corbeil (France / Europe)

●Old：Electrical wafer test location: currently released locations

●New：Electrical wafer test location: currently released locations+ Melexis Corbeil (France / Europe)

■Marking of parts / traceability of change

●Lots produced at X-fab Corbeil will have a different lot ID-number. The first letter of the lot ID will start with "F". Traceability ensured by lot number and datecode through the Melexis ERP system.

Brand of Product：	Melexis
Part#：	MLX90372 、 MLX90372GGO-ACE-300-RE 、 MLX90372GDC-ACE-300-RE 、 MLX90372GVS-ACE-308-RE More Part#
Product Category：	Integrated Circuits More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	DMPS4 GR MCM;TSSOP16 GR
Language：	English Chinese Chinese and English Japanese
Date of Creation：	21-Mar-2022
Version Number：
Data Encoding：	MCM-11939
Data Size：	5.3 MB