E2 and E3 Power Module Assembly and Test relocation Advanced announcement
To our valued customers ■I am pleased to announce that over the coming months we will consolidate and transfer all power modules housed in E2 and E3 packages from our Back End facility in Germany to our
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2302081419 Additional Assembly, Test and Ship Site for Si4x6x (20-QFN-4x4) & Si4x5x (20-QFN-3x3)
PCN Issue Date: Feb 08 2023 Effective Date: May 12 2023 PCN Type: Assembly Test Description of Change■Silicon Labs is pleased to announce the successful qualification of UNISEM M BERHAD as an additional
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Add R-Car M3 assembly site Product Change Notice (ADSL-C-23-0003)
■Description of Change: We will add assembly sites BGA substrate vendor and IC tray. ■Reason for Change: To increase production capacity. ■Impact on Fit Form Function Quality Reliability: Form fit: none
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Addition of a Wafer production site for RZ/A1L group Notice (PCN) (EPMP-IMB-23-0013-1)
Change Descriptions: ■Addition of a Wafer production site : Taiwan Semiconductor Manufacturing Co. Ltd. TSMC There is no change in the order part number. ■Regarding the production site we will decide in
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PCN # ESW490-47 – Thyristor & Diode SOT-227 Packaging Location Transfer
■Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor Diode products SOT-227 Package to our new inhouse assembly factory in Lipa Philippines. This brand-new
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