■Description of Change: Renesas will change tray for R-Car V3H products in REL Oita and Amkor Taiwan. Comparison before and after change Pocket design Pocket depth Z and Material will be changed. The red
Read moreWe are writing to announce package name of DFN PLP package will be changed because of the review of the package name due to the establishment of Nisshinbo Micro Devices Inc. Target products ■DFN PLP package
Read more■Type of change Move of all or part of electrical wafer test and/or final test to a different test site.■Description of change Old Electrical wafer test location: MLX Kuching Sarawak / Malaysia New Electrical
Read more■Overview: The purpose of this notification is to communicate that Renesas Electronics has begun the End-of-Life EOL Process on select part numbers. ■Affected Products: Attached is a list of products affected
Read moreDescription of Change: This notification is to advise our customers that Renesas is changing leadframe supplier from CWTC Japan to Rokko Malaysia due to the current supplier has ceased the operation. There
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