We are writing to announce the Change of Lead-frame and Mold-resin for DFN PLP package products which OSAT is Aoi Electronics Co. Ltd. AOI . Appearance comparison ①RP122K Special notes ■Basically only
Read more/ ■M23 SF ■ 2023 03 01 / Dear Sir or Madam ■The change to the knurl design of the M23 SF series To improve the bite the knurl design wasadapted more ridges . Furthermore the knurl material is changing
Read moreDetailed Description of Change ■Littelfuse IXYS Integrated Circuits Division ICD would like to inform you of introducing a previously approved second source for one of the components used in production
Read more■We would like to hereby request your kind understanding and acceptance of the following EOL End Of Life announcement due to the change of market situation or the discontinuance of component part.■Please
Read morePublication Date: 12/29/2022 Effective Date: 3/1/2023 Revision Description: Initial release. Description of Change: ■Renesas is adding types of tray and desiccant for LQFP/LFQFP package products which
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