MNG-2022-0055 Change Notice of Lead-frameand Mold-resin for DFN(PLP) products assembled by AOI
Post time:2024-06-05 16:46:39
Poster:Innovo Technology
From:Network
●We are writing to announce the Change of Lead-frame and Mold-resin for DFN(PLP) package products which OSAT is Aoi Electronics Co., Ltd. (AOI).
●Appearance comparison(①RP122K)
●Special notes
■Basically, only the following samples will be prepared. If you need a sample, please request from the following.
▲R5527K001D
▲RP118K331D
▲RP122K181D, RP122K301D, RP122K331D
▲RP123K351D
▲RP507K001B
Nisshinbo | |
R5527K001D 、 RP118K331D 、 RP122K181D 、 RP122K301D 、 RP122K331D 、 RP123K351D 、 RP507K001B 、 RP118Kxxxx-TR 、 RP122Kxxxx-TR 、 RP123Kxxxx-TR 、 R5527Kxxxx-TR 、 RP507Kxxxx-TR 、 R3200Kxxxx-TR 、 RP118K 、 RP122K 、 RP123K 、 R5527K 、 RP507K 、 R3200K More Part# | |
AOI More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
DFN(PLP);DFN(PLP)1010-4;DFN(PLP)1010-4B;DFN(PLP)1612-4D;DFN(PLP)1616-6D;DFN(PLP)2020-8B | |
English Chinese Chinese and English Japanese | |
10th November 2022 | |
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MNG-2022-0055 | |
613 KB |