Electronic News

Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Disc

Change Type: ■Wafer FAB Process Source DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes Incorporated has qualified an additional internal

Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Automotive Produc

Change Type: ■Additional Wafer Source Assembly Bill of Materials DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes Incorporated has

Device End of Life (EOL) (PCN-2550)

Change Type: ■Device End of Life EOL DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that the Lite-On Semiconductor LSC brand products listed below will no longer be available from

TO-277 Package Outline Change (ESW490-43)

Category of Change: ■Assembly Process ■Data Sheet Description of Change: ■Littelfuse would like to notify you that we will slightly change the outline of TO-277 package which will optimize the backend

Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products

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