Electronic News

Qualification of Internal ”Diodes Technology (Cheng Du) Company Limited” (CAT) as Additional Assembl

Change Type: ■Additional Assembly Test Site / Assembly Bill of Materials DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes has qualified

Device End of Life (EOL) (PCN-2587)

Change Type: ■End of Life EOL DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that products listed below will no longer be available from Diodes Incorporated. For select parts on this

Qualification of Additional Wafer Source PCN (PCN-2572)

Change Type: ■Additional Wafer Source DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes Incorporated has qualified Yea Shin Technology

Wafer Diameter Change from 6 inch to 8 inch at Diodes Internal BCD (Shanghai) Micro-Electronics Limi

Change Type: ■Wafer Fab Material DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes internal wafer fabrication source SFAB2 has qualified

Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembl

Change Type: ■Additional Die Revision RDL BUMP and A/T Site DESCRIPTION OF CHANGE ■This advance PCN is being issued to notify customers that in order to assure continuity of supply Diodes is qualifying

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