Additional Die Revision, Redistribution Layer (RDL), BUMP Sites (SJSEMI and LBS), as well as Assembl
Post time:2024-06-05 16:12:02
Poster:Innovo Technology
From:Network
●Change Type:
■Additional Die Revision, RDL, BUMP and A/T Site
●DESCRIPTION OF CHANGE
■This advance PCN is being issued to notify customers that in order to assure continuity of supply, Diodes is qualifying an additional Redistribution Layer (RDL) and BUMP site LB Semicon (LBS) located in the Republic of Korea, and an additional BUMP site SJ Semiconductor Corporation (SJSemi) located in JiangYin City, China, and an additional Diodes internal A/T site (CAT) located in Chengdu, China.
■Full electrical characterization and high reliability testing is ongoing on representative devices to ensure there is no change to device functionality or electrical specifications in the datasheet.
■Please note that dates mentioned above are best estimates derived from close coordination with our facilities. Specific implementation dates may change depending on completion of various qualifications over the next few months. The final PCN is expected to be issued by October 15, 2021 once qualification has been completed.
●IMPACT
■Continuity of Supply. There will be no change to the Form, Fit or Function of products affected, unless specifically indicated. No change in datasheet parameters and product performance.
DIODES | |
AP3445LW6-7 、 AP22908CN4-7 、 AP22908CNA4-7 、 AP22913CN4-7 、 AP22916BCA4-7 、 AP22916CCA4-7 、 AP61100Z6-7 、 AP61102Z6-7 、 AP61300Z6-7 、 AP61302Z6-7 More Part# | |
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PCN/EOL More | |
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Please see the document for details | |
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English Chinese Chinese and English Japanese | |
July 30, 2021 | |
REV 2 | |
PCN-2531 | |
88 KB |