AllaboutComponents

Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products

Additional Wafer Source and Alternate Assembly Lead Frame and Clip Bond for Select Discrete Products

Post time:2024-06-05 16:11:54

Poster:Innovo Technology

From:Network

●Change Type:
■Additional Wafer Source Assembly Bill of Materials
●DESCRIPTION OF CHANGE
■This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified Diodes internal KLFAB in Keelung, Taiwan as an additional wafer source, and alternate assembly lead frame and clip bond for select TVS products listed below.
■Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure no change to device functionality or electrical specifications in the datasheet. Refer to the attached qualification report embedded in this file (to view, download this PCN file then open it with a PDF viewer to see the attached qual report).
●IMPACT
■Continuity of Supply. There will be no change to the Form, Fit or Function of products affected, unless specifically indicated, i.e. package will have marking and package outline dimension (POD) changes as outlined in the tables below. No change in datasheet parameters and product performance.

DIODES

DM5W15A-13 、 DM5W16A-13 、 DM5W18A-13 、 DM5W24A-13 、 DM5W27-13 、 DM5W33A-13 、 DM5W36A-13 、 DM6W10A-13 、 DM6W18A-13 、 DM6W22A-13 、 DM6W24A-13 、 DM6W27-13 、 DM6W28A-13 、 DM6W36A-13 、 DM8W10A-13 、 DM8W16A-13 、 DM8W17A-13 、 DM8W18A-13 、 DM8W20A-13 、 DM8W22A-13 、 DM8W27-13 、 DM8W28A-13 、 DM8W30A-13 、 DM8W33A-13 、 DM8W36A-13 、 DM8W43A-13 、 DM8WxxAQ 、 DM8WxxA

More

Part#

TVS

More

More

PCN/EOL

More

More

Please see the document for details

More

More

DO-218

English Chinese Chinese and English Japanese

29 December, 2021

REV1

PCN-2564

170 KB