■Description of Change: We will add assembly sites BGA substrate vendor and IC tray. ■Reason for Change: To increase production capacity. ■Impact on Fit Form Function Quality Reliability: Form fit: none
Read moreWe are writing to announce the termination of former NJRC version labeling. Please refer to the following information for details. ■Applied products ▲All electronic device products of former New Japan
Read more■Description of Change: Alternate RDL Pad Plating facility of the listed Renesas WFQFN and TQFN packaged products Greatek Electronics Inc. Taiwan R.O.C Greatek This notice is to inform you that Nepes Corporation
Read moreNew NISD product label ■Former NJR Products : ▲No changes to the product label specification. Former NJR Products : Stick Packing. ■Label 1 barcode only on the packaging box will be abolished and only
Read moreWe are writing to announce EOL of DIP14 and DIP16 package products due to the difficulties of sustainable production and decrease in sales volume. Brand of Product：Nisshinbo,Part#：CXD9969AP,MCZ5203NA,NJM2058D,NJM2059D,NJM2060D,NJM2179D,NJM2188D,NJM2190D,N
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