This letter is to inform you that Laird™ Tpcm™ 670 Phase Change Thermal Interface Material will be transitioning through an end of life EOL process. The primary reasons for implementing EOL is diminishing
Read more■Description of Change: Renesas is changing the marking format on ZMOD4410AI2R and ZMOD4410AI2V to align with the AI1 version of the device as shown in the below diagram. ■Affected Product List: ZMOD4410AI2R
Read moreThis letter is to inform you that Laird™ Tgrease™ 880 Thermal Grease - Thermal Interface Material will be transitioning through an end of life EOL process. The primary reasons for implementing EOL is diminishing
Read moreDescription of Change ■Silicon Labs is pleased to announce the release of the following datasheet revisions for EZR32HG EZR32LG and EZR32WG devices. Reason for Change ■Update ordering information table
Read moreDescription of Change ■Silicon Labs is pleased to announce the release of datasheet version 1.1 for the C8051F96x devices. ■The datasheet has been updated to add a separate table Table 2.2 for Not Recommended
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