■Description of Change: This notice is to inform you that Renesas Electronics America Inc has updated ISL317xE ISL8307xE and ISL8308xE Products Datasheet. The updates include changes to the following :
Read more■Description of Change: This notice is to inform you that Renesas has updated the RA9530 datasheet as follows: ▲Section 4.3.2 Non-Volatile Memory Number of EEPROM/pseudo-flash re-programming cycles changed
Read more■Description of Change: Material change:Bonding wire change from Au wire to Cu wire ▲Lead frame Shape change : Applicable only to R8C/M12A Refer to page 2 onward for target part number ▲Mold resin Mold
Read more■Description of Change: Material change: ▲Lead frame Shape change ▲Mold resin Mold resin type addition. Uses two types of mold resin ■Affected Product List: This time we unify and apply to the part number
Read more■Description of Change: Add Back-End factories ▲Add the assembly factory Current: Renesas Semiconductor Beijing Co. Ltd RSB Addition: Greatek Electronics Inc. Greatek ▲Add the final test factory Current:
Read more