2404171522 Shipping Media Change for Si401x from Tube to Cut Tape Process Change Notice
■Description of Change Silicon Labs is pleased to announce the change of shipping media for Si401x 10-MSOP package products from tube to cut tape. The cut tape packing contains sealed carrier tape pockets
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PCN EIC-1131 Input Deactivation Control Changes for LAA127 and LBB127
Detailed Description of Change ■Littelfuse IXYS Integrated Circuits Division ICD would like to inform you of a change to the data sheet parameter Input Control Current to Deactivate and the addition of
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PCN # ESU270-91- New Wafer Foundry approval for SP1012-05WTG
To our valued customer ■Littelfuse would like to notify you that we are going to add a new wafer foundry for SP1012-05WTG due to current wafer fab unavailability. There are no changes to fit form and function
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ESDBT4V5FD1_DFN1610-2L PCN ESDBT4V5FD1_DFN1610-2L Process Change Notice EA202404002
■ ESDBT4V5FD1_DFN1610-2L A B ■ ESDBT4V5FD1_DFN1610-2L 2024/6 Change Contents:■Due to the adjustment of the company 39 s internal suppliers the ESDBT4V5FD1_DFN1610-2L products were changed from A packaging
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SOP16 PCN SOP16 package products Process Change Notice EA202404005
■SOP16 B A B ■ SOP16 package products 2024/6 Change Contents:■SOP16 package products to expand production capacity a new B package plant has been added. A and B package plants now work together.■The new
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