Devices affected:The CBRDFSH2-40 Schottky bridge rectifier manufactured in the BR DFN case.Extent of change:Change in wafer fab resulting in change in die size from 40 x 40 mils to 46 x 46 mils.Reason
Read moreDevices affected:The CBRDFSH1-40 Schottky bridge rectifier manufactured in the BR DFN case.Extent of change:Change in wafer fab resulting in change in die size from 32 x 32 mils to 35 x 35 mils.Reason
Read more/ ■ PT 2 5 UL 1059 /IEC 60947-7-1 ■ 2024 06 01 Dear Sir or Madam ■Due to growing market demand the PT PE ground terminals will be completely converted to the NEW design. The technical properties and approvals
Read moreParts Affected:Power transistor chip processes CP230 NPN and CP630 PNP wafers and bare die.Extent of Change:Complementary wafer processes CP230 NPN and CP630 PNP have been discontinued and are being replaced
Read more■ ESDBL7V0A1_DFNWB1.0x0.6-2L A B ■ ESDBL7V0A1_DFNWB1.0x0.6-2L XRF : XRF : Change Contents:■Due to the adjustment of the company 39 s internal suppliers the ESDBL7V0A1_DFNWB1.0x0.6-2L products were changed
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