Revision Description: Initial Release Description of Change:■Renesas is changing the marking format by replacing IDT with REN as shown in the below diagram. No change to form fit function reliability and
Read more■Brief Summary The MM32SPIN0280 and a number of SPIN driver products will be upgraded to Rev. C.■Description of Change The wafer fab process upgrade from 8-inch wafer to 12-inch wafer and the technology
Read moreWe are pleased to announce the Change of Lead-frame and Mold-resin for DFN PLP 1010-4B products. Please refer to the following information for details.■Applied products RP103Kxxxx-TRB RP103Kxxxx-TR-FF
Read moreLittelfuse would like to EOL Diode SOT-227UI package due to low demand for years and no replacement. Detail part number listed in the appendix. And another part number DHG40C600PB Power Diode Disc-Sonic
Read more■Littelfuse would like to notify you about the transfer of the backend manufacturing of our Bipolar modules in E2 package to our Outsourced Semiconductor Assembly and Test OSAT factory in Laguna Philippines.■This
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