■Littelfuse would like to notify you about the transfer of the backend manufacturing of our Bipolar modules in E2 package to our Outsourced Semiconductor Assembly and Test (OSAT) factory in Laguna, Philippines.
■This OSAT facility, a Littelfuse Back End partner since many years, build in mass production E2 products for Littelfuse already. This transfer refers to all our E2 BIPOLAR products, which have only been built in our Lampertheim facility so far until now.
■Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
■This PCN will first cover only E2 Bipolar products (mostly MCMA/MDMA/MDNA-series) and will be followed shortly by a second one for E2 IGBT Modules (MIXG-series) and then another one for E3 products.
■REASON OF CHANGE: Set the right balance for power modules assembly between internal and outsourced Back End facilities. Extend the E2 packages assembly being built in this facility additionally to other E2 products already built there.

Brand of Product：	Littelfuse
Part#：	MCMA 、 MDMA 、 MDNA-series 、 MDNA 、 MDMA-series 、 MCMA-series 、 MCMA240UI1600PED 、 MCMA240UI1600PED-PC 、 MCNA120UI2200PED 、 MCNA120UI2200PED-PC 、 MCNA120UI2200TED 、 MDMA280UB1600PTED 、 MDMA280UB1600PTED-PC 、 MDMA360UB1600PTED 、 MDMA360UB1600PTED-PC 、 MDMA450UB1600PTED 、 MDMA450UB1600PTED-PC 、 MDNA210UB2200PTED 、 MDNA210UB2200PTED-PC 、 MDNA210UB2200TED 、 MDNA240U2200ED 、 MDNA280UB2200PTED 、 MDNA280UB2200PTED-PC 、 MDNA360UB2200PTED 、 MDNA360UB2200PTED-PC 、 VVZB135-16IOXT 、 VVZB170-16IOXT 、 VVZB170-16IOXT-PFP More Part#
Product Category：	BIPOLAR Power Modules 、 Bipolar modules More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	E2
Language：	English Chinese Chinese and English Japanese
Date of Creation：	August 11th, 2023
Version Number：
Data Encoding：	LFPCN230811
Data Size：	595 KB
Effective Date：	September 2023
Type of Change：	Assembly Location Transfer