MMIC PRODUCT CHANGE NOTICE (19-049)
MODEL S AFFECTED: ■MMIC Devices using Package types: ▲MAV MCLP MXC MXP SOIC SOT-143 SOT-23 SOT-89 EXTENT OF CHANGE: ■Replacement of existing SnAgNi tin-silver over nickel plating with industry standard
Read moreMODEL S AFFECTED: ■MMIC Devices using Package types: ▲MAV MCLP MXC MXP SOIC SOT-143 SOT-23 SOT-89 EXTENT OF CHANGE: ■Replacement of existing SnAgNi tin-silver over nickel plating with industry standard
Read moreEXTENT OF CHANGE: ■Replacement of supplied transistor and varactor diode based on discontinuation of supply with alternate qualified components. ■Change of internal component values to optimize replacement
Read moreEXTENT OF CHANGE: ■Replacement of supplied transistor and varactor diode based on discontinuation of supply with alternate qualified components. ■Change of internal component values to optimize replacement
Read moreEXTENT OF CHANGE: ■Change of solder used in cover attachment process REASON FOR CHANGE: ■Increased use of higher reflow temperatures by customers requires a more robust cover attachment method. High temperature
Read moreEXTENT OF CHANGE: ■Replacement of supplied transistor and varactor diode based on discontinuation of supply with alternate qualified components. ■Change of internal component values to optimize replacement
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