●EXTENT OF CHANGE:
■Change of solder used in cover attachment process
●REASON FOR CHANGE:
■Increased use of higher reflow temperatures by customers requires a more robust cover attachment method. High temperature solder will not be affected by customer reflow. Epoxy dots at corners retained to add mechanical strength.
●EFFECTIVE DATE OF CHANGE:
■Immediate

Brand of Product：	Mini-Circuits
Part#：	JCIQ-156D-1+ 、 JCIQ-336D-1 、 JCIR-1015H-1+ 、 JCPS-6-10-1+ 、 JCIQ-156M-1+ 、 JCIQ-336M-1 、 JCIR-15-2A+ 、 JCPS-6-1450-1 、 JCIQ-176D 、 JCIQ-400D-1+ 、 JCIR-152H+ 、 JCPS-6-3 、 JCIQ-176D+ 、 JCIQ-400M-2+ 、 JCIR-25+ 、 JCPS-6-3-3 、 JCIQ-176M 、 JCIQ-70D-12 、 JCIR-2630-1 、 JCPS-8-10+ 、 JCIQ-176M+ 、 JCIQ-88M 、 JCIR-4MH 、 JCPS-8-850 、 JCIQ-176MH-1 、 JCIQ-88M+ 、 JCIR-4MH+ 、 JCPS-8-850+ 、 JCIQ-1880D 、 JCIQ-88M-4+ 、 JCIR-4MH-1N+ 、 JCPS-8-850-75+ More Part#
Product Category：	solder More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	April 23, 2018
Version Number：	Rev.: A
Data Encoding：	18-043
Data Size：	117 KB