■Description of Change: Case1: QFN package products Wafer fab: Powerchip Semiconductor Manufacturing Corporation PSMC addition Case2: LQFP package products Wafer fab: Powerchip Semiconductor Manufacturing
Read more■Outline of Changes Object: RA2E1 Wafer-fabrication: Renesas Semiconductor Manufacturing Co. Ltd. Kawashiri factory Chip-assembly: Renesas Semiconductor Beijing Co. Ltd RSB Package types: 7x7mm 48pin 10x10mm
Read more■As part of recent updates to the Emcon® product line and in our continuous efforts to bring the latest technologies to market we are announcing the end-of-sale and PCN dates for the TEMPEST Level I Getac
Read more■Summary: The CP742X wafer process is discontinued and now classified as End of Life EOL . ■Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed
Read more■As par t of recent updates to the Emcon® product line and in our continuous efforts to bring the latest technologies to market we are announcing the end-of-sale and PCN dates for the TEMPEST Level I HP
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