■Outline of Changes ：
●Object: RA2E1
◆Wafer-fabrication: Renesas Semiconductor Manufacturing Co., Ltd., Kawashiri factory
◆Chip-assembly: Renesas Semiconductor (Beijing) Co., Ltd (RSB)
◆Package types: 7x7mm 48pin, 10x10mm 64pin, LFQFP
●Wafer fabrication factory addition: Powerchip Semiconductor Manufacturing Corporation (PSMC)
◆Assembly factory addition: Greatek Electronics Inc.（Greatek）
●Specification differences:
◆Wafer process: sufficiently equivalent process was ported from Kawashiri factory.
◆Assembly materials: Lead-frame, Die-mount paste, and Mold-resin are certificated at each facility.​
●Package outline:
◆No change on the foot-print geometry
◆Please refer the package outline drawings and the geometry comparison tables.
●Marking:
◆Marking characters appears slightly different in the font type.
●Product specification/characteristics
◆No change
●Product qualification/reliability
◆No impact

Brand of Product：	Renesas
Part#：	RA2E1 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	LQFP;QFN;LFQFP;PLQP0064KL-A;PLQP0064KB-C;PLQP0048KL-A;PLQP0048KB-B
Language：	English Chinese Chinese and English Japanese
Date of Creation：	June/27/2022
Version Number：	Ver.1.0
Data Encoding：	MCP-AB-22-0069
Data Size：	1.1 MB