■Subject: K-MC1 / K-MC1 ■Description and Purpose of Change Change of internal oscillator/mixer design due to obsolete component. GaAs components have been exchanged by a SiGe MMIC. No change in fit and
Read more■Description of Change: Renesas is adding alternate assembly locations for select VFQFPN and FCLGA packages. Refer to below table for the current and the alternate assembly locations and its material sets
Read more■Subject: K-LC6 / K-LC6_V2 ■Description and Purpose of Change Change of internal oscillator/mixer design due to obsolete component. GaAs components have been exchanged by a SiGe MMIC. No change in fit
Read morePart Affected: The TIP112 NPN power transistor. Extent of Change: Change in die size from 84 x 84 mils to 89 x 89 mils. Reason for Change: As part of Central Semiconductor s supply chain risk mitigation
Read more■Description of Change: Renesas plans to add the site of assembly/final test for RZ/T1-M and EC-1 to realize stable supply. Renesas would like to deliver product produced in the added site for your orders.
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