●Part Affected: The TIP112 NPN power transistor.
●Extent of Change: Change in die size from 84 x 84 mils to 89 x 89 mils.
●Reason for Change: As part of Central Semiconductor’s supply chain risk mitigation initiative, and in an effort to ensure an undisrupted supply of product, a change in die size is being made for the product referenced above. Product specifications, quality and reliability are not impacted by this change.
●Effect of Change: This change does not affect the fit, form or function of the device.
●Qualification: Based on standards JESD22 and MIL-STD-750, qualification testing is in-process and data will be provided upon successful completion.
●Earliest Effective Date of Change: To be determined after completion of qualification testing.
●As per JEDEC standard JESD46, Customer Notification of Product/Process Changes by Solid-State Suppliers, a lack of acknowledgement of a PCN within thirty (30) days constitutes acceptance of the change.

Brand of Product：	Central Semiconductor
Part#：	TIP112 More Part#
Product Category：	NPN power transistor More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	July 21, 2022
Version Number：
Data Encoding：	PCN #238
Data Size：	94 KB