Description ■The following LSRAM configurations have derated FMAX specifications. Reason for Change ■On-going QA testing and verification exposed a timing criticality in a critical path within the LSRAM.
Read moreDescription ■The solder paste used for package decoupling capacitors will migrate from a RoHS-compliant solder paste to an Sn/Pb 63/37 solder paste. Reason for Change ■To mitigate against tin whisker growth.
Read moreReason for Change ■Streamlining internal processing by standardizing the packing method as part of the integration of Microsemi to Microchip processes. Products Affected by Change ■See document with list
Read moreDescription ■Microchip FPGA Business Unit is adding Microchip Technology Thailand MMT as an assembly and packaging site for Legacy RT and commercial FPGAs with gold bond wires. The impact is on the following
Read moreDescription ■Microsemi SoC group is currently performing qualification runs to convert SmartFusion in FG/FGG256 and IGL002/SmartFusion2 devices in TQ/TQG144 from Au wire to Gold Coated Palladium Copper
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