PCN20025: Migration of Solder Paste for Package Decoupling Capacitors from RoHS to Sn/Pb for PolarFi
Post time:2024-06-05 16:23:26
Poster:Innovo Technology
From:Network
●Description
■The solder paste used for package decoupling capacitors will migrate from a RoHS-compliant solder paste to an Sn/Pb (63/37) solder paste.
●Reason for Change
■To mitigate against tin whisker growth.
●Products Affected
■MPF300TS-FC484M
■MPF500TS-FC784M
■MPF500TS-FC1152M
| MICROSEMI | |
| MPF300TS-FC484M 、 MPF500TS-FC784M 、 MPF500TS-FC1152M More Part# | |
| decoupling capacitors More | |
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More | |
| PCN/EOL More | |
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Please see the document for details | |
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| English Chinese Chinese and English Japanese | |
| December 15, 2020 | |
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| PCN20025 | |
| 808 KB |