CN11-2018 CMV20000 Test diode pads unbonding
▼In order to ensure continuous improvement and increase reliability of our products ams Sensors Belgium has decided to remove test diode bonding wires on CMV20000. Brand of Product:AMS,Part#:CMV20000,302030004,302030003,302040004,302040005,CMV20000-1E5C1P
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IN01-2022 Change in Glass attach epoxy at KFT
As stated in PCN77-2021 ams-OSRAMAG plans to introduce a new glass attached epoxy WR8723K9B. Please be informed that the implementation date initially planned for January 2022 was moved to June 2022. Brand
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IN02-2022 Change in Font Size for CMV50K package marking
ams-OSRAM AG plans to introduce a new font size for CMV50K package marking. Please be informed that the implementation date is planned for February 2022. Brand of Product:AMS,Part#:302860003,302390003,302390004,CMV50000-1E3C1PA
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PCN16-2019 (Change from Standard to Customized JEDEC Trays) CMV20000 & CMV50000 product family
Please be informed that ams AG is changing the JEDEC trays for the packing of the CMV20000 CMV50000 image sensor families. This change is not affecting any product specifications only the packing form.
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PCN77-2021 Change in Glass attach epoxy at KFT
Please be informed that the current glass attached epoxy XNR5578 is EoL and therefore ams AG plans to introduce a new epoxy WR8723K9B. Brand of Product:AMS,Part#:302000004,302010004,302010010,301950006,301910006,301930005,301930007,302860003,302390003,CMV
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