CMV12000 Test diode pads unbonding CN11-2018
In order to ensure continuous improvementand increase reliability of our products ams Sensors Belgium has decided to remove test diode bonding wires on CMV12000. Brand of Product:AMS,Part#:301980004,301990004,302000004,302000005,302010004,302010005,302020
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CN55-2020–Test Location and Test Platform Change release for CMV12000 Mono
As stated in PCN04-2020 ams AG intends to release the transfer of the wafer probing as well as the final electrical test for the below products to the Teradyne IP750EX ATE test platform. Brand of Product:AMS,Part#:302010004,CMV12000-2E5M1PA
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CN48-2020–Serial Number marking method change
As stated in PCN36-2020 ams AG intends to change the serial number marking technique from Ink Jet to Laser Marking starting from ARF number: T352001. Please rest assured that theform fit and function of
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Test Location and Test Platform Change for CMV12000 PCN04-2020
Change Description ▼For the CMV12000 family ams is currently using proprietary testers developed and built inhouse. ams will transfer both the wafer probing as well as the final electrical test for the
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Product discontinuation
Reason for that is that the total demand for products has declined to such a level that an economic production can no longer be warranted. We therefore ask for your kind cooperation in the phasing out
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