Shipping medium change from Tube to Tray for listed Renesas TDFN , TQFN and DFN packaged products Pr
■Description of Change: This notice is to inform you that Renesas Electronics America Inc. will change shipping media from Tube to Tray for the listed Renesas Thin Dual Flat No Lead TDFN Thin Quad Flat
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MOSFET End-of-Life(EOL) Notice(2111003)
■Introduction: In accordance with PANJIT product discontinuance policy we are hereby giving announcement of these product life cycle update. In order to maintain our business viability and manufacturing
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Add Alternate Assembly Location on VFQFPN Packages Product Change Notice (PCN220015(R1))
■Description of Change: This revised notice is to add additional part numbers to this change. Renesas is adding Unisem Malaysia as an alternate assembly location for VFQFPN packages. Unisem has been qualified
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PCN EIC-1112 End of Life CPC1317P CPC1317PTR
As part of the Littelfuse IXYS Integrated Circuits Division s ICD product lifecycle-management process the following products have been transitioned to an end-of-life EOL status: CPC1317P CPC1317PTR In
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ER MUR Product EOL (2109004)
■Introduction: In accordance with PANJIT product discontinuance policy we are hereby giving announcement of these product life cycle update. ■Last Buy Date: 10th March 2022 ■Last Shipment Date: 10th April
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