■Due to supplier s molding compound end of life and to secure continuity of supply for our customers Littelfuse would like to inform you this Business Continuous Plan to replace existing molding compound
Read moreDescription of Change ■Silicon Labs is pleased to announce the release of errata revision 0.1 for BGX220P and BGX220S modules. ■Errata Description: BGX220P_E101 – Compliance of UK Regulations BGX220S_E101
Read moreLittelfuse would like to notify you of a change related to our flange mount reed sensor series 59135 59140 59141 59145 and 59150.■The marking on the products will change from quot HAMLIN quot to quot LITTELFUSE
Read moreDescription of Change ■Silicon Labs is pleased to announce the release of datasheet revision 1.4 for BGM13P and MGM13P modules jointly referred to as xGM13P and release of errata revision 0.2 for BGX13P
Read moreDescription of Change ■Silicon Labs is pleased to announce the release of datasheet revision 1.6 for BLED112 Bluetooth Low Energy Dongle. ■Notable changes from previous revision are: Updated 4.3 CE and
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