Wafer-fabrication and chip-assembly factories addition for RA2L1 QFN and LQFP package products Chang
■Description of Change: Case1: QFN package products▲Wafer fab: Powerchip Semiconductor Manufacturing Corporation PSMC addition Case2: LQFP package products▲Wafer fab: Powerchip Semiconductor Manufacturing
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2212071371 C8051F04x Datasheet v1.7 Release
Description of Change ■Silicon Labs is pleased to announce the release of datasheet version 1.7 for the C8051F04x devices. ■The datasheet has been updated to reflect the changes of the Product Selection
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2212071373 C8051F41x Datasheet v1.2 Release
Description of Change ■Silicon Labs is pleased to announce the release of datasheet version 1.2 for the C8051F41x devices. ■These changes are due to continued review of device performance and updates to
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2212071374 EFM32WG Datasheet v2.42 Release
Description of Change ■Silicon Labs is pleased to announce the release of datasheet version 2.42 for the EFM32WG devices. ■The datasheet has been updated to reflect the changes of the Ordering Information
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2212071389 Additional Assembly, Test and Ship Site for Si4x6x (20-QFN-4x4) & Si4x5x (20-QFN-3x3)
Description of Change ■Silicon Labs is pleased to announce this Advanced Change Notification of an additional assembly and test-ship site UNISEM M BERHAD for Si4x6x 20-QFN-4x4 Si4x5x 20-QFN-3x3 packages.
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