■Description of Change: For the RL78 / F13 F14 series with Cu bonding wire we are planning to add a front-end production factory. We target flexible production and stable supply by this change. Therefore
Read moreDescription of Change ■Silicon Labs is pleased to announce the successful qualification of a new Printed Circuit Board PCB supplier for xGM210P modules in Ryder. Upon PCN effective date Silicon Labs will
Read moreDescription of Change■Silicon Labs is pleased to announce Data Sheet version 1.0.10 for RS9116-B00 modules.■Notable changes from previous revision are:▲Provided Hardware Resetting sequence.▲ Added Absolute
Read more■Detailed Description of Change As part of the Littelfuse IXYS Integrated Circuits Division s ICD product lifecycle-management process the following products have been transitioned to an end-of-life EOL
Read moreDescription of Change■Silicon Labs announces an End of Life EOL and Last Time Buy LTB for BT121 Modules.■Existing customers may place LTB orders per the key dates above and guidelines listed in this EOL
Read more