Subject: Wafer-fabrication and chip-assembly factories addition for RA2E1 32pin QFN and 32pin LQFP package products. Publication Date: 10/4/2022 Effective Date: 4/30/2023 Revision Description: Initial
Read moreSubject: Addition of production sites for RL78/G11 24pin G1F G13 G14 G1C. Publication Date: 11/2/2022 Effective Date: 1/31/2023 Revision Description: Initial release. Description of Change:■Addition of
Read moreSubject: Addition of production sites for RL78/G11 16pin G1P I1D G1A. Publication Date: 11/4/2022 Effective Date: 10/31/2023 Revision Description: Initial release. Description of Change: ■Addition of QFN
Read moreObjective: ■The purpose of this project is to qualify the 2nd wafer source of DO-214AA package and additional EMC source of DO-214AA/DO-214AC packages. ■Succeeding pages summarize the physical electrical
Read more■Detailed Description of Change In order to ensure availability of the LCB710 family of devices to our valued customers Littelfuse IXYS Integrated Circuits Division ICD wishes to inform you of a necessary
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