2405081530 Additional Assembly, Test and Ship Site for xGM240P & xGM210P Modules Process Change
■Description of Change Silicon Labs is pleased to announce the successful qualification of STARS STARS Microelectronics as an additional assembly test and ship site for BGM240P and MGM240P xGM240P amp
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End of Life Notification of IXBOD1-07
To our valued customers ■Littelfuse would like to obsolete IXBOD1-07 due to lacking raw materials and no replacement. The current backlog in our system will be supported.▲Form fit function changes: NO▲Part
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ESDSU5V0A1_DFNWB1.0x0.6-2L ESDSU5V0A1_DFNWB1.0x0.6-2L Process Change Notice EC202404011
■ ESDSU5V0A1_DFNWB1.0x0.6-2L B ESDSU5V0A1_DFNWB1.0x0.6-2L 2024/6 Change Contents:■In order to expand production capacity ESDSU5V0A1_DFNWB1.0x0.6-2L product added B chip supply. The electrical parameters
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B1040A1 ESDBU3V3A1 ESDBU18VA1 ESDTU5V0A1 B1040A1 ESDBU3V3A1 ESDBU18VA1 ESDTU5V0A1 Process Change Not
■ ▲ ▲ ■B1040A1■ESDBU3V3A1■ESDBU18VA1■ESDTU5V0A1 2024/6 Change Contents:■Due to internal supplier adjustment we will be making the following changes to the gold bonding wires supplier for some products
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PCN491: Insource Dip Process
This notice is to inform you of the insourcing of a process affecting selected Littelfuse items that you have purchased.Description of the Change:We will be insourcing the Dip process used on the attached
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