Type
Board Level, Vertical
Package Cooled
Stud Mounted Semiconductor Cases
Attachment Method
Press Fit
Fin Height
2.000" (50.80mm)
Power Dissipation @ Temperature Rise
15.0W @ 37°C
Thermal Resistance @ Forced Air Flow
1.30°C/W @ 250 LFM
Thermal Resistance @ Natural
-
Material Finish
Black Anodized