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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
SMDLTLFP500T3C
DESCRIZIONE
SOLDER PASTE LOW TEMP T3 500G
DESCRIZIONE DETTAGLIATA
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)
PRODUTTORE
Chip Quik Inc.
INIZIATIVA STANDARD
4 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Chip Quik Inc.
Series
-
Package
Cartridge
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Cartridge, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
SMDLTL
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Altri nomi
-
Categoria
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDLTLFP500T3C
Documenti e supporti
Datasheets
1(SMDLTLFP500T3C Datasheet)
MSDS Material Safety Datasheet
1(SMD291SNL,SMD4300SNL,SMDLTLFP SDS)
HTML Datasheet
1(SMDLTLFP500T3C Datasheet)
Quantità Prezzo
QUANTITÀ: 1
Prezzo unitario: $127.95
Imballaggio: Cartridge
Moltiplicatore minimo: 1
Imballaggio: Cartridge
Moltiplicatore minimo: 1
Sostituti
-