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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
SMD291AX250T5
DESCRIZIONE
SOLDER PASTE SN63/PB37 250G T5
DESCRIZIONE DETTAGLIATA
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
PRODUTTORE
Chip Quik Inc.
INIZIATIVA STANDARD
3 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
Leaded
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.551 lb (249.93 g)
Base Product Number
SMD291
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
California Prop 65
Altri nomi
-
Categoria
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291AX250T5
Documenti e supporti
Datasheets
1(SMD291AX250T5)
MSDS Material Safety Datasheet
1(SMD291AX, SMD4300AX, TS391AX)
HTML Datasheet
1(SMD291AX250T5)
Quantità Prezzo
QUANTITÀ: 1
Prezzo unitario: $90.95
Imballaggio: Jar
Moltiplicatore minimo: 1
Imballaggio: Jar
Moltiplicatore minimo: 1
Sostituti
-