Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
SBU130Z
DESCRIZIONE
CONN SOCKET SIP 13POS GOLD
DESCRIZIONE DETTAGLIATA
13 (1 x 13) Pos SIP Socket Gold Through Hole
PRODUTTORE
On Shore Technology Inc.
INIZIATIVA STANDARD
8 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
200

Specifiche tecniche

Mfr
On Shore Technology Inc.
Series
SBU
Package
Bulk
Product Status
Active
Type
SIP
Number of Positions or Pins (Grid)
13 (1 x 13)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
196.9µin (5.00µm)
Contact Material - Post
Brass
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 125°C
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
7mOhm

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

Q1420247
SBU130Z-NDR

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/On Shore Technology Inc. SBU130Z

Documenti e supporti

Datasheets
1(SBU, DBU Series)
Environmental Information
1(OnShore RoHS/REACH)

Quantità Prezzo

QUANTITÀ: 200
Prezzo unitario: $0.50875
Imballaggio: Bulk
Moltiplicatore minimo: 200

Sostituti

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