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Germany400-PLS20001-16
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
400-PLS20001-16
DESCRIZIONE
CONN SOCKET PGA ZIF GOLD
DESCRIZIONE DETTAGLIATA
Pos PGA, ZIF (ZIP) Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
PLS
Package
Bulk
Product Status
Obsolete
Type
PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Bronze
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS)
Operating Temperature
-65°C ~ 200°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 400-PLS20001-16
Documenti e supporti
Datasheets
1(ZIF PGA)
Environmental Information
()
Quantità Prezzo
-
Sostituti
-