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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
1051209
DESCRIZIONE
63S4 MP218 ACP89V PASTE
DESCRIZIONE DETTAGLIATA
Leaded No-Clean Solder Paste Jar, 17.64 oz (500g)
PRODUTTORE
Harimatec Inc.
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Harimatec Inc.
Series
MP218
Package
Bulk
Product Status
Obsolete
Type
Solder Paste
Diameter
-
Melting Point
-
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8311.90.0000
Altri nomi
-
Categoria
/Product Index/Soldering, Desoldering, Rework Products/Solder/Harimatec Inc. 1051209
Documenti e supporti
Datasheets
()
Product Training Modules
1(Introduction to Solder Paste)
MSDS Material Safety Datasheet
1(1051209 SDS)
PCN Obsolescence/ EOL
1(Closing of Sale of Henkel’s Solder Material Business 06/MAY/2022)
PCN Packaging
1(Henkel/Berquist Revised Brands 10/May/2016)
HTML Datasheet
()
Quantità Prezzo
-
Sostituti
-