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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
18-1508-31
DESCRIZIONE
CONN IC DIP SOCKET 18POS GOLD
DESCRIZIONE DETTAGLIATA
18 (2 x 9) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
508
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Wire Wrap
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.500" (12.70mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
18-1508
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 18-1508-31
Documenti e supporti
Datasheets
1(508 Series Sgl/Dual Wire Wrap)
Environmental Information
()
HTML Datasheet
1(508 Series Sgl/Dual Wire Wrap)
Quantità Prezzo
QUANTITÀ: 36
Prezzo unitario: $13.52139
Imballaggio: Bulk
Moltiplicatore minimo: 36
Imballaggio: Bulk
Moltiplicatore minimo: 36
Sostituti
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