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Germany225-PLS18003-12
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
225-PLS18003-12
DESCRIZIONE
ZIF PGA SOCKET 225 PIN 18 X 18
DESCRIZIONE DETTAGLIATA
225 (15 x 15) Pos PGA, ZIF (ZIP) Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
1
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
PLS
Package
-
Product Status
Active
Type
PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)
225 (15 x 15)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS)
Operating Temperature
-
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
225-PLS
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 225-PLS18003-12
Documenti e supporti
Environmental Information
()
Quantità Prezzo
QUANTITÀ: 4
Prezzo unitario: $122.045
Imballaggio: -
Moltiplicatore minimo: 4
Imballaggio: -
Moltiplicatore minimo: 4
Sostituti
-