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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
DPF314-998Z
DESCRIZIONE
CONN IC DIP SOCKET 14POS TINLEAD
DESCRIZIONE DETTAGLIATA
14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
PRODUTTORE
Amphenol ICC (FCI)
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Amphenol ICC (FCI)
Series
DPF3
Package
Bag
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin-Lead
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.175" (4.45mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
DPF314
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Amphenol ICC (FCI) DPF314-998Z
Documenti e supporti
Datasheets
1(DPF3 Series)
PCN Obsolescence/ EOL
1(Multiple Devices/Sockets 04/Dec/2008)
HTML Datasheet
1(DPF3 Series)
Quantità Prezzo
-
Sostituti
-