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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
BDN17-3CB/A01
DESCRIZIONE
HEATSINK CPU W/ADHESIVE 1.71"SQ
DESCRIZIONE DETTAGLIATA
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
PRODUTTORE
CTS Thermal Management Products
INIZIATIVA STANDARD
14 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
1,000
STOCK FORNITORI
Specifiche tecniche
Mfr
CTS Thermal Management Products
Series
BDN
Package
Tray
Product Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.710" (43.43mm)
Width
1.710" (43.43mm)
Diameter
-
Fin Height
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
3.80°C/W @ 400 LFM
Thermal Resistance @ Natural
11.50°C/W
Material
Aluminum
Material Finish
Black Anodized
Shelf Life
24 Months
Base Product Number
BDN17
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
California Prop 65
Altri nomi
BDN173CB/A01
BDN173CBA01
294-1111
Categoria
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CTS Thermal Management Products BDN17-3CB/A01
Documenti e supporti
Datasheets
()
Environmental Information
()
HTML Datasheet
1(BDN Series, Adhesive Heat Sink)
Product Drawings
1(BDN17-3CB^A01)
Quantità Prezzo
QUANTITÀ: 1000
Prezzo unitario: $3.28381
Imballaggio: Tray
Moltiplicatore minimo: 1000
Imballaggio: Tray
Moltiplicatore minimo: 1000
Sostituti
-