Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
518-77-560M33-001105
DESCRIZIONE
CONN SOCKET PGA 560POS GOLD
DESCRIZIONE DETTAGLIATA
560 (33 x 33) Pos PGA Socket Gold Through Hole
PRODUTTORE
Preci-Dip
INIZIATIVA STANDARD
20 Weeks
MODELLO EDACAD
518-77-560M33-001105 Models
PACCHETTO STANDARD

Specifiche tecniche

Mfr
Preci-Dip
Series
518
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
560 (33 x 33)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
Flash
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
Flash
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
518-77

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

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Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Preci-Dip 518-77-560M33-001105

Documenti e supporti

Datasheets
()
Video File
1(PRODUCT DESIGN TIPS v017 microPGA Sockets and BGA Adapters)
Environmental Information
1(Preci-Dip Regulatory Info)
CAD Models
1(518-77-560M33-001105 Models)
HTML Datasheet
1(518-77-yyyMxx-zzz105)

Quantità Prezzo

QUANTITÀ: 288
Prezzo unitario: $76.25726
Imballaggio: Bulk
Moltiplicatore minimo: 288

Sostituti

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