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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
2-382724-1
DESCRIZIONE
CONN IC DIP SOCKET 40POS TIN
DESCRIZIONE DETTAGLIATA
40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
Diplomate DL
Package
Box
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Thermoplastic, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.128" (3.24mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
30mOhm
Base Product Number
382724
Classificazioni ambientali e di esportazione
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-382724-1
Documenti e supporti
Datasheets
1(382724)
Environmental Information
1(2-382724-1 Statement of Compliance)
Quantità Prezzo
-
Sostituti
-