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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
BGS13SL9E6327XTSA1
DESCRIZIONE
IC RF SWITCH SP3T 3GHZ TSLP9-3
DESCRIZIONE DETTAGLIATA
RF Switch IC Bluetooth, WLAN SP3T 3 GHz 50Ohm TSLP-9-3
PRODUTTORE
Infineon Technologies
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
7,500
STOCK FORNITORI
Specifiche tecniche
Mfr
Infineon Technologies
Series
-
Package
Tape & Reel (TR)
Product Status
Obsolete
RF Type
Bluetooth, WLAN
Topology
Reflective
Circuit
SP3T
Frequency Range
100MHz ~ 3GHz
Isolation
22dB
Insertion Loss
0.54dB
Test Frequency
2.7GHz
P1dB
-
IIP3
-
Features
-
Impedance
50Ohm
Voltage - Supply
2.4V ~ 3.6V
Operating Temperature
-30°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
9-XFLGA
Supplier Device Package
TSLP-9-3
Base Product Number
BGS13
Classificazioni ambientali e di esportazione
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Altri nomi
BGS13SL9E6327XTSA1DKR
BGS13SL9E6327XTSA1TR
SP001003646
BGS 13SL9 E6327
BGS13SL9E6327XTSA1CT
2156-BGS13SL9E6327XTSA1-ITTR
ROCINFBGS13SL9E6327XTSA1
Categoria
/Product Index/RF and Wireless/RF Switches/Infineon Technologies BGS13SL9E6327XTSA1
Documenti e supporti
Datasheets
1(BGS13SL9 Series)
Other Related Documents
1(Part Number Guide)
PCN Packaging
1(Mult Dev Packing Box Chg 18/Oct/2019)
HTML Datasheet
1(BGS13SL9 Series)
Quantità Prezzo
-
Sostituti
-