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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
233-PGM18039-51
DESCRIZIONE
CONN SOCKET PGA GOLD
DESCRIZIONE DETTAGLIATA
Pos PGA Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
PGM
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.165" (4.19mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
233-PGM
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 233-PGM18039-51
Documenti e supporti
Datasheets
1(Pin Grid Array Socket/Header)
Environmental Information
()
HTML Datasheet
1(Pin Grid Array Socket/Header)
Quantità Prezzo
-
Sostituti
-